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5 keys to next-generation IC packaging design - EDN
Lost in the advanced IC packaging labyrinth? Know these 10 basic terms - EDN
What Exactly is ESD for 3D ICs?
Advanced packaging for the future of 2.5D and 3D
What is 2D, 2.5D & 3D Packaging of Integrated Chips? - techovedas
Meeting the Growing Semiconductor Needs with Ingenuity, Optimized Design Solutions and Industry Partner Support
State-Of-The-Art of Advanced Packaging
2.5D vs. 3D Packaging, Advanced PCB Design Blog
EDA On Board With New Package Options
Design Technologies for Advanced Packaging
Open Platforms are the Foundation for Advanced System Design
Challenges and recent prospectives of 3D heterogeneous integration - ScienceDirect